Pack Expo International
November 6, 2016
Inland will again be exhibiting at this year’s premier packaging and processing event, Pack Expo International. This year’s tradeshow will take place Sunday, November 6th through Wednesday, November 9th in Chicago, Illinois at McCormick Place.
At Pack Expo International this year Inland will be showcasing its latest label and packaging offerings, including new extensions to our pressure sensitive label and flexible packaging products. Inland product experts will be available each day of the show at booth #6705 in Upper Lakeside Center. Register for free using Inland’s complimentary code 83B34.
In addition to our booth, Inland will also be presenting on the Innovation Stage on Wednesday, November 9th at 12:00 p.m. The presentation, titled “Smart Packaging – What’s the Reality?” will be given by Inland’s Packaging Innovation Director, Tricia Sime, in addition to Joao De Oliveira of PragmatIC. Global demand for active and intelligent packaging is forecasted to expand 7.5 percent annually to $7.6 billion by 2021, yet many brand owners are still asking “what’s the reality?” In this session Tricia and Joao will offer up the chance for package designers, engineers, brand managers and other product stakeholders to learn more about the initial stages of developing a smart product. Discussion will include how to determine project scope, when to establish key partnerships and what the various supply chain needs are when designing a “smart” package.